Copper Bump Chemistryphoto to be added · copper-bumbing-01.png
Copper Bump Chemistry
- Capable to operate at high current density
- High deposition rate
- Good uniformity and good bump shape
- Low gap and well-structured bump
A full range of water-based, non-flammable products for high-speed copper bumping, flux wash, deflashing, plating and wettable flank — engineered for outstanding quality, higher yield and longer bath life.
Necessary for customers due to restriction on waste treatment expansion:
Neutral base electrodeflash chemical enhances:
Product and process photography is being restored — captions above name each item. Specifications are available upon request via our contact page.
Our products are designed around your process and equipment — mostly without modification, and safer to handle, store and transport.